G576 explains how to select the reference clock (see page 32). Thank you! Look at the Device Diagrams section of UG575 (Packaging and Pinouts) for your device. 11. PROGRAMMABLE LOGIC, I/O AND PACKAGING. PROGRAMMABLE LOGIC, I/O & BOOT/CONFIGURATION. . Please provide the clarification related to this issue. 4*120 Pin Panasonic Connectors, Reserved expansion IOs (PS PCIe Gen2 x 4; 2 x USB 3. . Does Xilinx provide OrCAD symbol files ? If not, how to use the ASCII Pinout Files in ug575 to create OrCAD symbols in (. Virtex UltraScale Programmable Logic, I/O and Packaging Programmable Logic, I/O & Boot/Configuration Knowledge Base. 1) September 14, 2021 11/24/2015 1. I'm using the KU060 in a relatively low power design. You will have to adjust the location constraints and check that the design topology can be done the same way. Thanks for your reply. This helps to achieve timing closure of the design. 1) August 16, 2018 09/15/2015 1. Is the 6mil shown here a mistake?PCIe Reset on VU11P on bank 65. • If all of the Quads in a power supply group are not used, the associated power pins can be left unconnected or tied to GND (unless the RCAL circuit is in that Quad). The marking that is not even shown in the UG575 is the three digit number in right bottom corner. pdf. tzr is for Icepak and pdml is for Flotherm thermal tool import. DragonBoard USA Announces Update to UL Floor and Ceiling Assembly G575. . PS: IOSTANDARD property is not needed for such port. Loading Application. Why?Hi @victor_dotouchshe7 ，. 1 Removed “Advance Spec ification” from document ti tle. 3 IP name: IBERT Ultrascale GTH version: 1. Dragonboard Magnesium Oxide Board (MgO) is a lightweight alternative to poured concrete. Date V ersion Revision. Look at the Device Diagrams section of UG575 (Packaging and Pinouts) for your device. Related Questions. You can refer to UG575 to check which ports can be used as GT's reference clock. Like Liked Unlike Reply. 通过 BRAM 实现 PS 与 PL 数据交互 21. The AMD DDR4 core can generate a full controller or phy only for custom controller needs. 6. 11). 5M System Logic Cells leveraging 2 nd generation 3D IC. . I suppose the XCAU25P is the same as XCKU3P, so please refer to the KU3P in the xlxs. From ug575: Expand Post. 6 で、正しい座標情報が含まれるようになる予定です。Hi, We will use Virtex Ultra+ FPGA (XCVU13P-2FLGA2577E) in our project. I've read the thermal section in UG575, but I don't have the capability or know-how to perform thermal modeling. Spartan™ 6 FPGA Package Files. pdf? Unfortunately, I cannot find informtation on this in pg188-hig-speed-selectIO-wiz. // Documentation Portal . Using the buttons below, you can accept cookies, refuse cookies, or change. Zynq® UltraScale+ devices provide 64-bit processor scalability while combining real-time. 1 Removed “Advance Spec ification” from document ti tle. Got another unique addition to my collection of chips. As you say, the STARTUPE3 is needed to access the CCLK output of the FPGA, which connects to both flash devices. UG575 (v1. Hello, I am looking for a UG that specifically states which banks are in the same column. The Radeon Pro 575 is a professional mobile graphics chip by AMD, launched on June 5th, 2017. I recustomized my PS to have GPIO set up to use a range of MIO, and I see that my package pins in the Implementation flow are (apparently) correctly assigned to the port names. Page 88 of the UG1075 document contains I/O bank diagram of the FBVB900 package. 5mm min and 0. hello, Regarding soldering of the XCKU060-2FFVA1517E (used in one of our projects): ug1099 (v1. BR. com. My specific concern is the height from the seating plane (dimension A). Hi @andremsrem2,. Regards, Musthafa V. All Answers. The controller will run up to 2400Mbps in UltraScale and 2667Mbps in UltraScale+. ,Ltd. Expand Post. UG575 adalah bandar slot teraman dengan bonus deposit, freebet / freechip tanpa deposit, promo anti rungkat, bonus rebate mingguan, bonus member baru, deposit pulsa tanpa potongan, perfect attendant (absensi mingguan), bonus referral, bonus happy hour, extra bonus TO (TurnOver) bulanan, cashback mingguan, winrate tertinggi, proses. g. Loading Application. 5Gb/s. UG575 (v1. Are there any rules of thumb for power draw threshold from the ultrascale parts that requires a heat sink? I suspect my design will be fine without one. UG575 gives only an very high level map. Download as Excel. For example if you want to find the pin planning information for UltraScale / UltraScale+ devices go. You don't even need to open Vivado to get this information, it is available in text format in the User Guides. 6. L4630 4630 For more information would like to show you a description here but the site won’t allow us. Loading Application. 8 mm and 1. necare81 (Member) Edited August 18, 2023 at 1:43 PM. Ultrascale+ Packaging & Pinouts (UG575) tells me that there is in fact a Quad 231 on the right side of the device. Hi @watari (Member) , thanks for the answer! I am still missing a bit. . Table 1-5 in UG575(v1. Resources Developer Site; Xilinx Wiki; Xilinx GithubPlease refer page 328 of UG575 (v1. 0) and UG575 (v1. For Versal AM013 - packaging and pinouts. Hi, Sir: I implemented a IBERT ip in the design, but the link was got wrong location (X0Y73) with no-link in Quad126. E. A third way to answer the question is to create a Vivado project for your device and open the “Package Pins” window shown below. (rouhgly 13*51 - 1/2 * 51 HP and 2 * 24. Walshe, 2008, Literary Productions edition, in English. > I found a newer version of the document and it had the device I am usingPackaging. Can anyone verify this for me please? Thank you, Joe. Note this key quote in particular: Unlike features in an ASIC or a microprocessor, the combination of FPGA features used in a user application is not known to the component supplier. When synthesizing with the VU13P part, it is expected that bank 127 should be We would like to show you a description here but the site won’t allow us. comnis2 ,. 5Gb/s. Table 1: Absolute Maximum Ratings(1) (Cont’d) Symbol Description Min Max Units Send Feedback. {"payload":{"allShortcutsEnabled":false,"fileTree":{"VCU128/docs":{"items":[{"name":"rdf0489-vcu128-bit-c-2019-1","path":"VCU128/docs/rdf0489-vcu128-bit-c-2019-1. 5Gb/s. 11). All banks in the same SLR and column in those diagrams are in the same "I/O bank column". All other packages liste d 1mm ball pitch. Description: Extended/Direct Handle Motor Disconnect Switch. Bank Diagram is in the UG575 regarding the XCAU25P-FFVB784. 6). What is the meaning of this table？. 2 12 13. Specified as each individual output channel at TA = 25°C, VIN1 = VIN2 = 12V, unless otherwise noted per the typical application shown in. 基于 ADC 模块 Scatter/Gather DMA 使用(AN108) 27. All other packages listed 1mm ball pitch. 6) April 25, 2016, PAGE 166 to see if I can find the mapping info for the Per bank Quad block and its associated Analog supply pins. 46 [get_ports SYSCLK_P]Hi team, Would like to confirm if package type of MPN: XC6VLX240T-2FFG1156C belongs to FFVA1156? Thanks. Hello @rmirosanros5, Ah, if you're using a Zynq device then you'll need to look at UG1075. I always wondered where I can find the physical location of every single resource of an FPGA. . 5Gb/s. 8 is the drawing you looking for. ddn (AMD) Edited by User1632152476299482873 September 25, 2021 at 3:29 PM **BEST SOLUTION**. 3 of UG575 will be available and if it will be compatible with the new KU085 and KU095 devices. . Introduction to UltraScale and UltraScale+ FPGAs Packaging and Pinouts: This section describes the packages and pinouts for the UltraScale architecture-based FPGAs in various organic flip-chip 0. Bee (Customer) 7 months ago. . Loading Application. The most useful chapters for you will be chapter. Is the 6mil shown here a mistake? Thank you. Expand Post. FPGA Bank Columns. co. The package file for this FPGA (ref ug575) shows that these pins are in the FPGA bank 45 and are I/O type HP. Also, here is an AR for your reference. 使用的是KCU1500开发板，外接时钟是差分时钟模式，而我配置DDR4 SDRAM（MIG） 如下图使用No Buffer模式： 请问这种模式应该如何连接时钟？Bank Diagram is in the UG575 regarding the XCAU25P-FFVB784. (XAPP1283) Internal Programming of BBRAM and eFUSEs. Resources Developer Site; Xilinx Wiki; Xilinx GithubThanks for the answer. Clocking Overview. POWER & POWER TOOLS. Meaning, I cannot find "Quad 231" there. Like Liked Unlike Reply. All Answers. 9. It is market as PC44CEM0015 F1117188A The marking is in bright white and easily readable. GC inputs can connect to the PHY adjacent to the. Date V ersion Revision. : ID Numbers Open Library OL754986M ISBN 10 3881803181, 3881803408 LCCN 97150347 Goodreads 5493532. After I changed to dedicated ports for GT's reference clock and things are right. A very similar package (FFVA1156) which I found in the document UG575 has three different heights listed for different parts (Figures 4-12, 4-13 and 4-14), so I'm not sure if the listed nominal height (A=3. Selected as Best Selected as Best Like Liked Unlike 3 likes. 0. MarkHi. このユーザー ガイ. The table shows that the KU11P has 4 PCIe4 Integrated Blocks. GitLab. Ultrascale+ Packaging & Pinouts (UG575) tells me that there is in fact a Quad 231 on the right side of the device. . I dont find in ug575. This site uses cookies from us and our partners to make your browsing experience more efficient, relevant, convenient and personal. The information is available in UG575 (Ultrascale and Ultrascale+ FPGAs Packaging and Pinouts) document. Symbol Description 1, UltraScale Architecture Configuration User Guide UG570 (v1. Flexible via high-speed interconnection boards or cables. A very similar package (FFVA1156) which I found in the document UG575 has three different heights listed for different parts (Figures 4-12, 4-13 and 4-14), so I'm not sure if the listed nominal height (A=3. The similar Bank is the XCKU3P-SFVB784/FFVD900, too. // Documentation Portal . // Documentation Portal . only drawing a few watts. Note: The zip file includes ASCII package files in TXT format and in CSV format. Solution. 15) September 9, 2021 Revision History The following table shows the revision ug585-Zynq-7000-TRM. All Answers. GTH transceivers in A784, A676, and A900 packages support data rates. Loading Application. The similar Bank is the XCKU3P-SFVB784/FFVD900, too. 8mm ball pitch. Expand Post. Up to 674 free user I/O for daughter board connection. 11). This is because the value of BACKBONE is defeatured in the Versal Architecture. In order to use Tandem PCIe, PCIe Block Locations are X1Y2 for VU9P (as per Figure 1-100 in UG575 v1. A second way to answer the question is to download the package file for your FPGA from <here>. Ex. Standard 2075, Edition 2 Edition Date: March 05, 2013 ANSI Approved: August 04, 2023 USD. S u m m a r y The Xilinx® Kintex® UltraScale+™ FPGAs are available in -3, -2, -1 speed grades, with -3E devices having the highest performance. Hello @hpetroffxey5 . R evision His t ory. . POWER & POWER TOOLS. R evision His t ory. 2 version. The guidelines when using DCI cascading are as follows:We would like to show you a description here but the site won’t allow us. . We would like to show you a description here but the site won’t allow us. 0. 61903. 1, Page-300), for which Bank Locations are D-C (as per Figure 1-100 in. 5mm min and 0. 7. Could you please provide the datasheet or specs for the maximum operating temperature (i. I wen through UG575 but couldnt find the I/O column and bank. 1 Removed “Advance Spec ification” from document ti tle. 12) helps us. I reviewed your issue related to the location of PCIe and GT quad location available in ug575, page 110. Also, we are trying to validate the I2C path on VCU108 EVM from FPGA to SYSMON as shown below and not trying to access it via JTAG or by instantiating it in design. Preview. proFPGA with AMD Virtex UltraScale+ XCVU13P FPGA. Usually solder-mask is 4mil larger that the solder land. . 3 is not available yet and. 302 p. I see that some of these are in-stock at digikey. Resources Developer Site; Xilinx Wiki; Xilinx Github Bank Diagram is in the UG575 regarding the XCAU25P-FFVB784. The format of this file is described in UG1075. vhd がアップデートされました。 『UltraScale および UltraScale+ FPGA パッケージおよびピン配置ユーザー ガイド』 (UG575) の第 1 章「パッケージ概要」の「ダイ レベルでのバンク番号の概要」を参照してください。 1) . 2, but not find the device speed grade. Selected as Best Selected as Best Like Liked Unlike 1 like. A very similar package (FFVA1156) which I found in the document UG575 has three different heights listed for different parts (Figures 4-12, 4-13 and 4-14), so I'm not sure if the listed nominal height (A=3. . . pdf","path":"Datasheet/XILINX/ds180_7Series_Overview. PL 读写 PS 端 DDR 数据 20. Both of these blocks have fixed locations for the particular device package combination. Even an ACSII version would be helpful. You also see the available banks in ug575, page63, figure 1-16. There are Four HP Bank. This package thermal details are required to simulate Micron module with VU13P package with appropriate thermal constraints like ambient and flow conditions. Device : xcku085 flva1517 vivado version: 2018. My questions: 1. The Thermal model should be out soon too. Article Details. Hello, I am using the Zynq Ultrascale\+ MPSoC part #XCZU19EG-2FFVE1924I and looking on page 378 of the UltraScale Device Packaging and Pinouts UG575 (v1. UltraScale Device Packaging and Pinouts UG575 (v1. Selected as Best Selected as Best Like Liked Unlike. GTH transceivers in A784, A676, and A900 packages support data rates up to 12. roym (Employee) 2 years ago. "Quad X1 Y5" Starting GT Lane e. Hello, I was trying to find some thermal specs for the XCKU115-FLVA1517 Ultrascale FPGA module but am not having any luck. 5. // Documentation Portal . Now i imported my. In some cases, they are essential to making the site work properly. VIVADO. I suppose the XCAU25P is the same as XCKU3P, so please refer to the KU3P in the xlxs. 12. I have followed pG150,UG575 etc for understanding the various constraints and followed the same. junction, case, ambient, etc. Resources Developer Site; Xilinx Wiki; Xilinx Github; Support Support CommunityUG575. Due to doc references, I found out I need the Quad X0Y2 (Bank 226), but the doc doesn't specify which lane is routed to the GTM SMA connectors. ddn (AMD) Edited by User1632152476299482873 September 25, 2021 at 3:29 PM **BEST SOLUTION**. // Documentation Portal . RF & DFE. com. g. // Documentation Portal . OTHER INTERFACE & WIRELESS IP. Loading Application. The island. <p></p><p. This question is for testing whether or not you are a human visitor and to prevent automated spam submissions. . 9/9/2014. Hi, Does anybody have the schematic symbol for the VU190 FLGB2104 device? I plan to do my schematic with Altium Designer. DMA 使用之 DAC 波形发生器(AN108) 23. Loading Application. Maximum achievable performance is device and package dependent; consult the associated data sheet for details. I believe this is the correct drawing of the deminsions. The controller will run up to 2400Mbps in UltraScale and 2667Mbps in UltraScale+. 使用的是KCU1500开发板，外接时钟是差分时钟模式，而我配置DDR4 SDRAM（MIG） 如下图使用No Buffer模式： 请问这种模式应该如何连接时钟？Bank Diagram is in the UG575 regarding the XCAU25P-FFVB784. Loading Application. 45. For pin naming conventions, refer to the UltraScale Architecture Packaging and Pinout User Guide (UG575) [Ref 2]. The similar Bank is the XCKU3P-SFVB784/FFVD900, too. For devices with high-bandwidth memory (HBM), the storage temperature is the case surface temperature on the center/top side of the device. Number of pages 366 ID Numbers Open Library OL5622879M LCCN 68033368. Built on the 14 nm process, and based on the Ellesmere graphics processor, in its Ellesmere XLA variant, the chip supports DirectX 12. Reader • AMD Adaptive Computing Documentation Portal. 12) to determine available IOSTANDARDs. Loading Application. Saturday 13-May-2023 08:02AM PDT. UG575 (v1. 0 mm pitch BGA packages. It includes diagrams, tables, and. musthafavakeri (Member) 6 years ago **BEST SOLUTION** Hi All,XCKU060-2FFVA1517E soldering. Hi @andremsrem2,. The web page is a forum thread from Xilinx users who discuss the topic of UG575 v1. 6) August 26, 2019 11/24/2015 1. For a quick estimate you can look at bank numbers, usually they are consecutive for the same column with a gap between columns but there is no number gap for the SLR split. Programmable Logic, I/O and Packaging Programmable Logic, I/O & Boot/Configuration Kintex UltraScale Knowledge. . Lists. pdf. For UltraScale parts you can find the info in UG575 packaging and pinouts. However, during the Aurora IP customization I can only select: Starting Quad e. -- -- This file contains confidential and proprietary information -- of Xilinx, Inc. "X1 Y20" Column Used: e. R evision His t ory. Resources Developer Site; Xilinx Wiki; Xilinx GithubLTM4644/LTM4644-1 1 Re For more information n Quad Output Step-Down µModule® Regulator with 4A per Output n Wide Input Voltage Range: 4V to 14V n 2. For pin naming conventions, refer to the UltraScale Architecture Packaging and Pinout User Guide (UG575) [Ref 2]. The AMD DDR4 core can generate a full controller or phy only for custom controller needs. Expand Post. Virtex™ 5 FPGA Package Files. You can refer to UG575 to check which ports can be used as GT's reference clock. 6) August 26, 2019 11/24/2015 1. Community Reviews (0) Feedback? No community reviews have been submitted for this work. Xilinx does not provide OrCAD schematic symbols. Thermal. I'm stuck in the Aurora IP customization. This site uses cookies from us and our partners to make your browsing experience more efficient, relevant, convenient and personal. All banks in the same SLR and column in those diagrams are in the same "I/O bank column". OLB) files for the schematic design. UltraScale Architecture SelectIO Resources 6 UG571 (v1. For reference, we provide BRD, Gerber, schematic, and layout files for our evaluation kits. // Documentation Portal . 28 says that the data pins and chip-select are dedicated for UltraScale whereas the corresponding pins in a 7series device are multi-function (UG475, p. Resources Developer Site; Xilinx Wiki; Xilinx GithubDoes Maximum PCB solder land (L) diameter (see attached pic for UG575) really refers to the maximum value? Is there a typical value? Which value is it recommended to use? 3. DMA 环通测试 22. All rights reserved. Loading Application. 查看了UG575的 Soldering Guidelines ，是不是200°以上持续时间偏长（140s），要求是60–150s；且不应该是260度（文档上要求为FFVA1156，Mass reflow:245°）焊接引起的。UG575 adalah judi online terbaru dengan bonus deposit, extra bonus TO (TurnOver) bulanan, bonus happy hour, cashback mingguan, bonus rebate mingguan, freebet / freechip tanpa deposit, promo anti rungkat, bonus referral, bonus member baru, perfect attendant (absensi mingguan), deposit pulsa tanpa potongan, winrate tertinggi,. 0. 6). POWER & POWER TOOLS. I am looking for the diagram for ultrascale+ Artix FPGAs. All other packages listed 1mm ball pitch. Are they marked in ug575-ultrascale-pkg-pinout. But what about the applied pressure on the lidless FPGA? We can read page 326 : "Xilinx recommends that the. Regards, Cousteau. Product Specification (UG575) . 8mm ball pitch. . Is there a hardwired dedicated reset pin to Ultrascale FPGAs? I couldn't find any information about one in the UG575 "packaging and pinouts" paper. So you need to choose a combination that makes PCIe hardblock closer to GT quad. Bank Diagram is in the UG575 regarding the XCAU25P-FFVB784. 1 answer. Does Maximum PCB solder land (L) diameter (see attached pic for UG575) really refers to the maximum value? Is there a typical value? Which value is it recommended to use? 3. Product Application Engineer Xilinx Technical Support要找一下 kintex-ultrascale系列器件的BANK 0 pin脚配置说明；请告知具体在哪一份文档？. A comparative study was carried out to produce silica nanoparticles (S-SiO2, R. Resources Developer Site; Xilinx Wiki; Xilinx Github UG575 (v1. AMD Adaptive Computing Documentation Portal. ) Go ASCII Pinout Files chapter in this Device Packaging and Pinouts guide. 12) March 20, 2019 Chapter 1: Pack aging Overview Zynq® UltraScale+ MPSoC devices provide 64-bit processor scalability while combining UG575, UltraScale and UltraScale+ FPGAs Packaging and Pinouts Product Specification UG576, UltraScale Architecture GTH Transceivers User Guide UG578, UltraScale Architecture GTY Transceivers User Guide UG579, UltraScale Architecture DSP Slice User Guide UG580, UltraScale Architecture System Monitor User Guide UltraScale Architecture GTH Transceivers 6 UG576 (v1. e. See UG575, UltraScale Architecture Packaging and Pinouts User Guide for more information. What is the meaning of this table？. g. In some cases, they are essential to making the site work properly. 18) April 22, 2022 Chapter 4: Mechanical Drawings UBVA368 Flip-Chip, Fine-Pitch BGA (XCAU10P and XCAU15P) X-Ref Target - Figure 4-1 Figure 4. No - although some would refer you to the GSR (Global Set/Reset) pin of the STARTUPE3 primitive - see page 118 of UG570(v1. 5 VIL Low Level Logic Input Voltage 0 0. AMD offers a comprehensive multi-node portfolio to address requirements across a wide set of applications. Resources Developer Site; Xilinx Wiki; Xilinx Github デバイス ビューの座標情報が正しいため、ug575 を修正するよう変更リクエストが提出されています。 2016 年 1 月以前にリリース予定の ug575 v1. In some cases, they are essential to making the site work properly. TXT) or (. Loading Application. A user asks when version 1. . 1 answer. 7. You can only route the reference clock to adjacent quads and the should be no SLR crossing between them. Expand Post. 0. vu13p デバイスで合成した場合、(ug575) の記述に基づくと、バンク 127 が使用されるべきです。 しかし、バンク 124 が代わりに使用されます。 これについては、合成されたデザインを開いて [I/O Ports] タブを表示することにより確認できます。@kimjaewonim98 . I have attached a link to UG575, which will give you an idea on how to design the thermal management system for your part. It seems there is a discrepancy between the Ultrascale selection guide for XCKU095 there is written 650 HP I/O and 52 HR I/O for the B1760 package and in the UG575 page 25 Table 1-4 FFVB1760 package 598 HP I/O and 52 HR I/O. Also, I am looking for the maximum allowable junction temperature. 12. Product Application Engineer Xilinx Technical Support Loading Application. **BEST SOLUTION** Hello @rmirosanros5, These behaviors are hard coded when the IP Is generated. Resources Developer Site; Xilinx Wiki; Xilinx Github 注 : zip ファイルには、txt および csv 形式の ascii パッケージ ファイルが含まれます。このファイル形式は、ug575 で説明されています。 Note: The zip file includes ASCII package files in TXT format and in CSV format. Expand Post. hello, Regarding soldering of the XCKU060-2FFVA1517E (used in one of our projects): ug1099 (v1. Up to 1. Resources Developer Site; Xilinx Wiki; Xilinx Github9 Detailed Mechanical drawings, including package dimensions and BGA ball pitch, are available for the Lidless packages in the UltraScale and UltraScale+ FPGAs Packaging and Pinouts Product Specification User Guide (UG575) [Ref 1] and Zynq UltraScale+ Device Packaging and Pinouts Product Specification User Guide (UG1075) [Ref 2], as appropriate. Categories: Child care and day care. Reader • AMD Adaptive Computing Documentation Portal. The general info should be located in the package implementation Xilinx application notes like xapp426/xapp427, UG112, and/or UG575/UG1075. We would like to show you a description here but the site won’t allow us. PROGRAMMABLE LOGIC, I/O & BOOT/CONFIGURATION. FPGA in question: XCKU085. Product Application Engineer Xilinx Technical SupportLoading Application. デバイス資料 (ザイリンクス) 『Zynq-7000 SoC テクニカル リファレンス マニュアル』 (UG585) は、Zynq SoC のアーキテクチャ、機能、および制御およびステータス レジスタの詳細な説明を含む総合的なユーザー ガイド (1700ページ以上) です。. Dragonboard Magnesium Oxide Board (MgO) is a lightweight alternative to poured concrete. Product Application Engineer Xilinx Technical SupportWe would like to show you a description here but the site won’t allow us. Look at the Device Diagrams section of UG575 (Packaging and Pinouts) for your device. Generic IOD Interface Implementation. All other packages listed 1mm ball pitch. How DragonBoard is Made. 7mm max) for UltraScale devices in B2104 package. the _RN bank is not connected in xcku060-ffva1517. **BEST SOLUTION** Hi @dragonl2000lerl3,. This pin is actually connected to the SMBALERT of SYSMONE4_ TS pin. there is no version of Virtex Ultrascale+ that supports HD banks. Could you please provide the datasheet or specs for the maximum operating temperature (i. 2 Note: Table, figure, and page numbers were accurate for the 1. Resources Developer Site; Xilinx Wiki; Xilinx Github; Support Support CommunityHi, We will use Virtex Ultra+ FPGA (XCVU13P-2FLGA2577E) in our project. and is protected under U.